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Author: K. Saito


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Reference
K. Saito and F. Furuta, “Sulfur Generation Mechanism During Electropolishing with Niobium Cavities”, in Proc. 14th Int. Conf. RF Superconductivity (SRF'09), Berlin, Germany, Sep. 2009, paper THPPO090, pp. 838-838.
K. Saito, F. Furuta, Y. Higashi, and T. Saeki, “High Power Test Results of LL Cavity Package in STF0.5 Program at KEK”, in Proc. 14th Int. Conf. RF Superconductivity (SRF'09), Berlin, Germany, Sep. 2009, paper TUPPO023, pp. 239-239.
S. Mitsunobu et al., “MgB2 Thin Films on Copper, Titanium and Niobium by Pulse Laser Deposition in KEK”, in Proc. 14th Int. Conf. RF Superconductivity (SRF'09), Berlin, Germany, Sep. 2009, paper TUPPO077, pp. 413-417.
K. Saito, “Basic Principles of SRF”, presented at the 12th Int. Conf. RF Superconductivity (SRF'05), Ithaca, NY, USA, Jul. 2005, paper SUA01, unpublished.
H. Matsumoto, S. Kazakov, and K. Saito, “A New Design for the ILC-45MV/m Cavity Input Coupler”, in Proc. 12th Int. Conf. RF Superconductivity (SRF'05), Ithaca, NY, USA, Jul. 2005, paper THP51, pp. 583-583.
Y. Higashi et al., “Coaxial Ball Screw Tuner for ICHIRO 9-Cell Cavity”, in Proc. 12th Int. Conf. RF Superconductivity (SRF'05), Ithaca, NY, USA, Jul. 2005, paper THP61, pp. 611-611.
Y. Morozumi et al., “Design and Analysis of 45 MV/m Superconducting Structures”, in Proc. 12th Int. Conf. RF Superconductivity (SRF'05), Ithaca, NY, USA, Jul. 2005, paper TUP19, pp. 282-282.
T. Saeki et al., “Fabrication of Four 9-cell ICHIRO High-Gradient Cavities for the RD of ILC Accelerator in KEK”, in Proc. 12th Int. Conf. RF Superconductivity (SRF'05), Ithaca, NY, USA, Jul. 2005, paper TUP20, pp. 282-282.
K. Saito, Y. Higashi, T. Higo, Y. Morozumi, and H. Yamaoka, “Mechanical Structure Analysis for ICHIRO 9-Cell Cavity”, in Proc. 12th Int. Conf. RF Superconductivity (SRF'05), Ithaca, NY, USA, Jul. 2005, paper TUP21, pp. 283-283.
K. Saito et al., “RD Activities for ILC High Gradient Cavity in KEK”, in Proc. 12th Int. Conf. RF Superconductivity (SRF'05), Ithaca, NY, USA, Jul. 2005, paper TUP44, pp. 347-347.


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