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Author: Y. Yang


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Reference
Y. Yang et al., “A high brightness electron beam research and application beamline at Tsinghua University”, in Proc. 14th Int. Particle Accelerator Conf. (IPAC'23), Venice, Italy, May 2023, paper TUPL152, pp. 2093-2096.
Y. Wu et al., “BEPCII Interaction Region Design and Construction Status”, in Proc. 21st Particle Accelerator Conf. (PAC'05), Knoxville, TN, USA, May 2005, paper WOAD005, pp. 478-480.
Y. Tang, Y. Yang, Y. Zhai, Z. Jia, and L. Sun, “Design of a 10.156 MHz pre-buncher for a heavy ion RFQ”, in Proc. 14th Int. Particle Accelerator Conf. (IPAC'23), Venice, Italy, May 2023, paper MOPL122, pp. 836-839.
Y. Li et al., “Uniformization of the Transverse Beam Profile with Nonlinear Magnet”, in Proc. 12th Int. Particle Accelerator Conf. (IPAC'21), Campinas, Brazil, May 2021, pp. 4413-4416.
Y. Li et al., “Research on longitudinal dynamics and design of RF parameters of synchrotron for XiPAF-upgrading project”, in Proc. 14th Int. Particle Accelerator Conf. (IPAC'23), Venice, Italy, May 2023, paper TUPM134, pp. 2545-2548.
Y. Li et al., “Experiment and Simulation Study on the Capture and Acceleration Process of XiPAF Synchrotron”, in Proc. 12th Int. Particle Accelerator Conf. (IPAC'21), Campinas, Brazil, May 2021, pp. 4409-4412.
Y. L. Xu et al., “Phase Extraction and Stabilization for Coherent Pulse Stacking”, in Proc. 9th Int. Particle Accelerator Conf. (IPAC'18), Vancouver, Canada, Apr.-May 2018, pp. 4895-4897.
Y. L. Xu et al., “FPGA Control of Coherent Pulse Stacking”, in Proc. North American Particle Accelerator Conf. (NAPAC'16), Chicago, IL, USA, Oct. 2016, pp. 367-369.
Y. He et al., “The Conceptual Design of One of Injector II of ADS in China”, in Proc. 2nd Int. Particle Accelerator Conf. (IPAC'11), San Sebastian, Spain, Sep. 2011, paper WEPS053, pp. 2613-2615.
Y. B. Leng, Z. C. Chen, L. W. Lai, Y. B. Yan, and Y. Yang, “Bunch by Bunch DBPM Processor Development and Preliminary Experiment in SSRF”, in Proc. 6th Int. Particle Accelerator Conf. (IPAC'15), Richmond, VA, USA, May 2015, pp. 984-986.


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