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Author: X. Shen


References



Reference
K. Zhou et al., “Commissioning of the 2x4-cell Superconducting Accelerator for the CAEP THz-FEL Facility”, in Proc. 13th Symposium on Accelerator Physics (SAP'17), Jishou, China, Aug. 2017, pp. 96-98.
K. Zhou et al., “Progress of the 2x4-Cell Superconducting Accelerator for the CAEP THz-FEL Facility”, in Proc. 18th Int. Conf. RF Superconductivity (SRF'17), Lanzhou, China, Jul. 2017, pp. 134-136.
L. Dallin et al., “Canadian Light Source Status and Commissioning Results”, in Proc. 9th European Particle Accelerator Conf. (EPAC'04), Lucerne, Switzerland, Jul. 2004, paper THPKF007, pp. 2269-2271.
L. E. Malin et al., “Comparison of Theory, Simulation, and Experiment for Dynamical Extinction of Relativistic Electron Beams Diffracted Through a Si Crystal Membrane”, in Proc. 8th Int. Particle Accelerator Conf. (IPAC'17), Copenhagen, Denmark, May 2017, pp. 3924-3927.
L. E. Malin et al., “Experiments Producing Nanopatterned Electron Beams”, in Proc. 9th Int. Particle Accelerator Conf. (IPAC'18), Vancouver, Canada, Apr.-May 2018, pp. 1553-1555.
M. A. K. Othman et al., “Terahertz Driven Compression and Time-Stamping Technique for Single-Shot Ultrafast Electron Diffraction”, in Proc. 12th Int. Particle Accelerator Conf. (IPAC'21), Campinas, Brazil, May 2021, pp. 492-494.
M. A. K. Othman et al., “THz-Based Femtosecond MeV Electron Bunch Compression”, in Proc. 10th Int. Particle Accelerator Conf. (IPAC'19), Melbourne, Australia, May 2019, pp. 3766-3768.
M. Boland et al., “Design of a new S-band 250 MeV electron linac with RF SLED compression for the CLS”, in Proc. 14th Int. Particle Accelerator Conf. (IPAC'23), Venice, Italy, May 2023, paper TUPL108, pp. 1981-1984.
M. J. Boland et al., “Concept Design for the CLS2 Accelerator Complex”, in Proc. 12th Int. Particle Accelerator Conf. (IPAC'21), Campinas, Brazil, May 2021, pp. 354-356.
M. Li et al., “Status of CAEP THz Free Electron Laser Oscillator”, in Proc. 60th ICFA Advanced Beam Dynamics Workshop on Future Light Sources (FLS'18), Shanghai, China, Mar. 2018, pp. 154-156.


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