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Author: X. Shen


References



Reference
P. Li et al., “First Lasing at the CAEP THz FEL Facility”, in Proc. 39th Int. Free Electron Laser Conf. (FEL'19), Hamburg, Germany, Aug. 2019, pp. 11-14.
M. Othman, A. Gabriel, P. Kramer, E. Nanni, and X. Shen, “Terahertz Time Stamping Tool Development for SLAC MeV-UED”, presented at the 14th Int. Particle Accelerator Conf. (IPAC'23), Venice, Italy, May 2023, paper TUPA057, unpublished.
M. Li et al., “Status of CAEP THz Free Electron Laser Oscillator”, in Proc. 60th ICFA Advanced Beam Dynamics Workshop on Future Light Sources (FLS'18), Shanghai, China, Mar. 2018, pp. 154-156.
M. J. Boland et al., “Concept Design for the CLS2 Accelerator Complex”, in Proc. 12th Int. Particle Accelerator Conf. (IPAC'21), Campinas, Brazil, May 2021, pp. 354-356.
M. Boland et al., “Design of a new S-band 250 MeV electron linac with RF SLED compression for the CLS”, in Proc. 14th Int. Particle Accelerator Conf. (IPAC'23), Venice, Italy, May 2023, paper TUPL108, pp. 1981-1984.
M. A. K. Othman et al., “THz-Based Femtosecond MeV Electron Bunch Compression”, in Proc. 10th Int. Particle Accelerator Conf. (IPAC'19), Melbourne, Australia, May 2019, pp. 3766-3768.
M. A. K. Othman et al., “Terahertz Driven Compression and Time-Stamping Technique for Single-Shot Ultrafast Electron Diffraction”, in Proc. 12th Int. Particle Accelerator Conf. (IPAC'21), Campinas, Brazil, May 2021, pp. 492-494.
L. E. Malin et al., “Experiments Producing Nanopatterned Electron Beams”, in Proc. 9th Int. Particle Accelerator Conf. (IPAC'18), Vancouver, Canada, Apr.-May 2018, pp. 1553-1555.
L. E. Malin et al., “Comparison of Theory, Simulation, and Experiment for Dynamical Extinction of Relativistic Electron Beams Diffracted Through a Si Crystal Membrane”, in Proc. 8th Int. Particle Accelerator Conf. (IPAC'17), Copenhagen, Denmark, May 2017, pp. 3924-3927.
L. Dallin et al., “Canadian Light Source Status and Commissioning Results”, in Proc. 9th European Particle Accelerator Conf. (EPAC'04), Lucerne, Switzerland, Jul. 2004, paper THPKF007, pp. 2269-2271.


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