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Author: S. M. Pattalwar


References



Reference
P. Pizzol et al., “CVD Deposition of Nb Based Materials for SRF Cavities”, in Proc. 7th Int. Particle Accelerator Conf. (IPAC'16), Busan, Korea, May 2016, pp. 2241-2244.
O. B. Malyshev et al., “First Results of Magnetic Field Penetration Measurements on Multilayer S-I-S Structures”, in Proc. 7th Int. Particle Accelerator Conf. (IPAC'16), Busan, Korea, May 2016, pp. 2245-2247.
P. Goudket et al., “Superconducting Thin Film RF Measurements”, in Proc. 9th Int. Particle Accelerator Conf. (IPAC'18), Vancouver, Canada, Apr.-May 2018, pp. 3856-3858.
O. B. Malyshev et al., “Design, Assembly and Commissioning of a New Cryogenic Facility for Complex Superconducting Thin Film Testing”, in Proc. 9th Int. Particle Accelerator Conf. (IPAC'18), Vancouver, Canada, Apr.-May 2018, pp. 3859-3861.
S. Wilde et al., “Physical Vapour Deposition of NbTiN Thin Films for Superconducting RF Cavities”, in Proc. 8th Int. Particle Accelerator Conf. (IPAC'17), Copenhagen, Denmark, May 2017, pp. 1102-1104.
S. M. Pattalwar et al., “New Connection Cryostat to Insert FP420 Proton Tagging Detector in the LHC Ring”, in Proc. 4th Asian Particle Accelerator Conf. (APAC'07), Indore, India, Jan.-Feb. 2007, paper TUPMA001, pp. 103-105.
P. A. Corlett et al., “A Superconducting RF Vertical Test Facility at Daresbury Laboratory”, in Proc. 11th European Particle Accelerator Conf. (EPAC'08), Genoa, Italy, Jun. 2008, paper MOPP125, pp. 850-852.
P. A. McIntosh et al., “Commissioning of the ERLP SRF Systems at Daresbury Laboratory”, in Proc. 11th European Particle Accelerator Conf. (EPAC'08), Genoa, Italy, Jun. 2008, paper MOPP141, pp. 889-891.
S. M. Pattalwar et al., “Progress Report on the International Cryomodule at Daresbury”, in Proc. 53th Advanced ICFA Beam Dynamics Workshop on Energy Recovery Linacs (ERL'13), Novosibirsk, Russia, Sep. 2013, paper WG307, pp. 62-65.
K. J. Peach et al., “PAMELA Overview and Status”, in Proc. 1st Int. Particle Accelerator Conf. (IPAC'10), Kyoto, Japan, May 2010, paper MOPEA021, pp. 112-114.


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