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J. Guo et al., “Investigation of 26MHz RFQ Accelerators”, in Proc. 1st Asian Particle Accelerator Conf. (APAC'98), Tsukuba, Japan, Mar. 1998, paper 4D048, pp. 196-198. |
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J. Guo et al., “Pulsed Operation of CEBAF for JLEIC Injection”, in Proc. 29th Linear Accelerator Conf. (LINAC'18), Beijing, China, Sep. 2018, pp. 682-684. |
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J. Guo et al., “Studies on Superconducting Thin Films for SRF Applications”, in Proc. 25th Linear Accelerator Conf. (LINAC'10), Tsukuba, Japan, Sep. 2010, paper THP042, pp. 854-856. |
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J. Guo, D. W. Martin, S. G. Tantawi, and C. Yoneda, “A Cryogenic RF Material Testing Facility at SLAC”, in Proc. 1st Int. Particle Accelerator Conf. (IPAC'10), Kyoto, Japan, May 2010, paper WEPEC073, pp. 3049-3051. |
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J. Guo, D. W. Martin, S. G. Tantawi, and C. Yoneda, “Cryogenic RF Material Testing at SLAC”, in Proc. 24th Particle Accelerator Conf. (PAC'11), New York, NY, USA, Mar.-Apr. 2011, paper TUP102, pp. 1030-1032. |
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J. Guo, D. W. Martin, S. G. Tantawi, and C. Yoneda, “Testing the RF Properties of Novel Super Conducting Materials”, in Proc. 15th Int. Conf. RF Superconductivity (SRF'11), Chicago, IL, USA, Jul. 2011, paper TUIOB03, pp. 325-329. |
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J. Guo, F. Lin, R. A. Rimmer, H. Wang, S. Wang, and Y. Zhang, “Conceptual MEIC Electron Ring Injection Scheme using CEBAF as a Full Energy Injector”, in Proc. 6th Int. Particle Accelerator Conf. (IPAC'15), Richmond, VA, USA, May 2015, pp. 2232-2235. |
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J. Guo, J. D. Fox, T. Mastoridis, R. A. Rimmer, H. Wang, and S. Wang, “Transient Beam Loading and Mitigation in JLEIC Collider Rings”, in Proc. 10th Int. Particle Accelerator Conf. (IPAC'19), Melbourne, Australia, May 2019, pp. 758-761. |
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J. Guo, J. Henry, M. Poelker, R. A. Rimmer, R. Suleiman, and H. Wang, “A Non-Invasive Magnetic Momentum Monitor Using a TE011 Cavity”, in Proc. 9th Int. Particle Accelerator Conf. (IPAC'18), Vancouver, Canada, Apr.-May 2018, pp. 4889-4891. |
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J. Guo, J. Henry, M. Poelker, R. A. Rimmer, R. Suleiman, and H. Wang, “Using a TE011 Cavity as a Magnetic Momentum Monitor”, in Proc. 7th Int. Beam Instrumentation Conf. (IBIC'18), Shanghai, China, Sep. 2018, pp. 111-113. |
