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Author: T. M. Huang


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Reference
T. M. Huang et al., “The Window Replacement and Q Recovery of BEPCII Storage Ring SCC”, in Proc. 8th Int. Particle Accelerator Conf. (IPAC'17), Copenhagen, Denmark, May 2017, pp. 1046-1048.
T. M. Huang et al., “The Improvement of the Power Coupler for CADS SC Spoke Cavities”, in Proc. 18th Int. Conf. RF Superconductivity (SRF'17), Lanzhou, China, Jul. 2017, pp. 220-222.
T. M. Huang et al., “The Fundamental Power Coupler for CEPC Booster Cavity”, in Proc. 19th Int. Conf. RF Superconductivity (SRF'19), Dresden, Germany, Jun.-Jul. 2019, pp. 789-794.
T. M. Huang et al., “The development of a high power input coupler for China ADS injector I RFQ”, in Proc. 4th Int. Particle Accelerator Conf. (IPAC'13), Shanghai, China, May 2013, paper THPWO041, pp. 3857-3859.
T. M. Huang et al., “Status and Progress of the High-Power RF System for High Energy Photon Source”, in Proc. 12th Int. Particle Accelerator Conf. (IPAC'21), Campinas, Brazil, May 2021, pp. 3653-3656.
T. M. Huang et al., “High Power Input Couplers for C-ADS”, in Proc. 17th Int. Conf. RF Superconductivity (SRF'15), Whistler, Canada, Sep. 2015, paper THPB101, pp. 1383-1386.
T. M. Huang et al., “Design Optimization of the 166-MHz and 500-MHz Fundamental Power Couplers for Superconducting RF Cavities at High Energy Photon Source”, in Proc. 20th International Conference on RF Superconductivity (SRF'21), East Lansing, MI, USA, Jun.-Jul. 2021, pp. 544.
R. P. Wells, B. Ghiorso, F. Sannibale, J. W. Staples, and T. M. Huang, “Design and Fabrication of a VHF - CW High Repetition Rate Electron Gun”, in Proc. 5th Int. Particle Accelerator Conf. (IPAC'14), Dresden, Germany, Jun. 2014, pp. 733-735.
Q. Y. Wang et al., “Development of a 166.6 MHz Digital LLRF System for HEPS-TF Project”, in Proc. 19th Int. Conf. RF Superconductivity (SRF'19), Dresden, Germany, Jun.-Jul. 2019, pp. 1073-1077.
P. Zhang et al., “The 166.6 MHz Proof-of-principle SRF Cavity for HEPS-TF”, in Proc. 18th Int. Conf. RF Superconductivity (SRF'17), Lanzhou, China, Jul. 2017, pp. 454-458.


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