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Author: J. Taguchi


References



Reference
D. Luo et al., “Analysis of High Field Q-Slope (HFQS) Causes and Development of New Chemical Polishing Acid”, in Proc. North American Particle Accelerator Conf. (NAPAC'19), Lansing, MI, USA, Sep. 2019, pp. 699-702.
E. Kako et al., “Quality Control of Copper Plating in STF-2 Input Power Couplers”, in Proc. 18th Int. Conf. RF Superconductivity (SRF'17), Lanzhou, China, Jul. 2017, pp. 186-190.
J. Taguchi et al., “R&D of Electro-polishing (EP) Process with HF-free Neutral Electrolyte by Bipolar-pulse (BP) Method”, in Proc. 18th Int. Conf. RF Superconductivity (SRF'17), Lanzhou, China, Jul. 2017, pp. 623-627.
J. Taguchi, A. Namekawa, H. Hayano, T. Saeki, C. E. Reece, and H. Tian, “Study on Electro-polishing of Nb Surface by Periodic Reverse Current Method with Sodium Hydroxide Solution”, in Proc. 7th Int. Particle Accelerator Conf. (IPAC'16), Busan, Korea, May 2016, pp. 2020-2022.
Y. Okii et al., “R&D of Copper Electroplating Process for Power Couplers: Effect of Microstructures on RRR”, in Proc. 19th Int. Conf. RF Superconductivity (SRF'19), Dresden, Germany, Jun.-Jul. 2019, pp. 278-281.


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