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Author: H. Hayano


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Reference
H. Tongu, Y. Iwashita, H. Hayano, and Y. Yamamoto, “XT-map System for Locating SC Cavity Quench Position”, in Proc. 16th Int. Conf. RF Superconductivity (SRF'13), Paris, France, Sep. 2013, paper TUP114, pp. 747-750.
F. Furuta et al., “Vertical Electropolishing Studies at Cornell”, in Proc. 17th Int. Conf. RF Superconductivity (SRF'15), Whistler, Canada, Sep. 2015, paper MOPB093, pp. 364-367.
K. N. Nii et al., “Improvement of Temperature Control During Nb 9-Cell SRF Cavity Vertical Electro-Polishing (VEP) and Progress of VEP Quality”, in Proc. 17th Int. Conf. RF Superconductivity (SRF'15), Whistler, Canada, Sep. 2015, paper MOPB098, pp. 381-384.
V. Chouhan et al., “Symmetric Removal of Niobium Superconducting RF Cavity in Vertical Electropolishing”, in Proc. 17th Int. Conf. RF Superconductivity (SRF'15), Whistler, Canada, Sep. 2015, paper MOPB105, pp. 409-413.
V. Chouhan et al., “Recent Development in Vertical Electropolishing”, in Proc. 17th Int. Conf. RF Superconductivity (SRF'15), Whistler, Canada, Sep. 2015, paper THBA02, pp. 1024-1030.
S. Kato and H. Hayano, “Plasma-enhanced ALD System for SRF Cavity”, in Proc. 18th Int. Conf. RF Superconductivity (SRF'17), Lanzhou, China, Jul. 2017, pp. 870-872.
Y. Iwashita et al., “R&D of Thin Film Coating on Superconductors”, in Proc. 18th Int. Conf. RF Superconductivity (SRF'17), Lanzhou, China, Jul. 2017, pp. 877-880.
H. Oikawa, H. Hayano, and T. Higashiguchi, “Design Study of Mushroom Shaped Cavity for Evaluation of RF Critical Magnetic Field of Thin-film Superconductor”, in Proc. 18th Int. Conf. RF Superconductivity (SRF'17), Lanzhou, China, Jul. 2017, pp. 914-916.
F. Furuta et al., “Vertical Electro-polishing Collaboration Between Cornell, KEK, and Marui Galvanizing Co. Ltd”, in Proc. 18th Int. Conf. RF Superconductivity (SRF'17), Lanzhou, China, Jul. 2017, pp. 563-566.
V. Chouhan et al., “Study on Vertical Electropolising of 9-cell Niobium Coupon Cavity”, in Proc. 18th Int. Conf. RF Superconductivity (SRF'17), Lanzhou, China, Jul. 2017, pp. 602-606.


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