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Author: A. Terashima


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Reference
A. Yamamoto et al., “Development of LHC Low-β Quadrupole Magnets at KEK”, in Proc. 19th Particle Accelerator Conf. (PAC'01), Chicago, IL, USA, Jun. 2001, paper RPPH313, pp. 3633-3635.
D. Kostin et al., “S1-Global Module Tests at STF/KEK”, in Proc. 2nd Int. Particle Accelerator Conf. (IPAC'11), San Sebastian, Spain, Sep. 2011, paper MOODA02, pp. 38-40.
E. Kako et al., “S1-Global Collaborative Efforts - 8-Cavity-Cryomodule: 2 FNAL, 2 DESY and 4 KEK”, in Proc. 25th Linear Accelerator Conf. (LINAC'10), Tsukuba, Japan, Sep. 2010, paper MO302, pp. 31-35.
H. Hayano et al., “Results Achieved by the S1-Global Collaboration for ILC”, in Proc. 26th Linear Accelerator Conf. (LINAC'12), Tel Aviv, Israel, Sep. 2012, paper TH1A01, pp. 748-752.
K. Tsuchiya et al., “Cryomodule Development for Superconducting RF Test Facility (STF) at KEK”, in Proc. 10th European Particle Accelerator Conf. (EPAC'06), Edinburgh, UK, Jun. 2006, paper MOPCH190, pp. 505-507.
K. Umemori et al., “Improvement of Magnetic Condition for KEK-STF Vertical Test Facility Toward High-Q Study”, in Proc. 18th Int. Conf. RF Superconductivity (SRF'17), Lanzhou, China, Jul. 2017, pp. 444-447.
M. Masuzawa, A. Terashima, K. Tsuchiya, A. Dael, O. Napoly, and J. Plouin, “Magnetic Shielding: Our Experience with Various Shielding Materials”, in Proc. 16th Int. Conf. RF Superconductivity (SRF'13), Paris, France, Sep. 2013, paper WEIOD02, pp. 808-811.
N. Ohuchi et al., “Construction of the S1-Global Cryomodules for ILC”, in Proc. 1st Int. Particle Accelerator Conf. (IPAC'10), Kyoto, Japan, May 2010, paper WEPE008, pp. 3356-3358.
N. Ohuchi et al., “Status of LHC Low-Beta Quadrupole Magnets, MQXA, at KEK”, in Proc. 20th Particle Accelerator Conf. (PAC'03), Portland, OR, USA, May 2003, paper WPAE019, pp. 1978-1980.
N. Ohuchi et al., “The First Cool-down Tests of the 6 Meter-Long-Cryomodules for Superconducting RF Test Facility (STF) at KEK”, in Proc. 11th European Particle Accelerator Conf. (EPAC'08), Genoa, Italy, Jun. 2008, paper MOPP144, pp. 892-894.


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