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Author: T. Miura


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Reference
D. Kostin et al., “S1-Global Module Tests at STF/KEK”, in Proc. 2nd Int. Particle Accelerator Conf. (IPAC'11), San Sebastian, Spain, Sep. 2011, paper MOODA02, pp. 38-40.
T. Miura et al., “Performance of the Micro-TCA Digital Feedback Board for DRFS Test at KEK-STF”, in Proc. 2nd Int. Particle Accelerator Conf. (IPAC'11), San Sebastian, Spain, Sep. 2011, paper MOPC155, pp. 445-447.
T. Matsumoto et al., “Operation Test of Distributed RF System with Circulator-less Waveguide Distribution in S1-Global Project at STF/KEK”, in Proc. 2nd Int. Particle Accelerator Conf. (IPAC'11), San Sebastian, Spain, Sep. 2011, paper MOPC156, pp. 448-450.
S. Michizono et al., “Performance of LLRF System at S1-Global in KEK”, in Proc. 2nd Int. Particle Accelerator Conf. (IPAC'11), San Sebastian, Spain, Sep. 2011, paper MOPC157, pp. 451-453.
N. Ohuchi et al., “Thermal Performance of the S1-Global Cryomodule for ILC”, in Proc. 2nd Int. Particle Accelerator Conf. (IPAC'11), San Sebastian, Spain, Sep. 2011, paper WEPO035, pp. 2472-2474.
T. Higo et al., “Linac Upgrade in Intensity and Emittance for SuperKEKB”, in Proc. 3rd Int. Particle Accelerator Conf. (IPAC'12), New Orleans, LA, USA, May 2012, paper TUPPR005, pp. 1819-1821.
K. Furukawa et al., “High-intensity and Low-emittance Upgrade of 7-GeV Injector Linac towards SuperKEKB”, in Proc. 4th Int. Particle Accelerator Conf. (IPAC'13), Shanghai, China, May 2013, paper TUPME010, pp. 1583-1585.
F. Qiu et al., “Evaluation of the Superconducting LLRF system at cERL in KEK”, in Proc. 4th Int. Particle Accelerator Conf. (IPAC'13), Shanghai, China, May 2013, paper WEPME015, pp. 2956-2958.
S. Sakanaka et al., “Progress in Construction of the 35 MeV Compact Energy Recovery Linac at KEK”, in Proc. 4th Int. Particle Accelerator Conf. (IPAC'13), Shanghai, China, May 2013, paper WEPWA015, pp. 2159-2161.
E. Kako et al., “High Power Tests of Injector Cryomodule for Compact-ERL”, in Proc. 4th Int. Particle Accelerator Conf. (IPAC'13), Shanghai, China, May 2013, paper WEPWO013, pp. 2340-2342.


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