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Author: Y. Hao


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Reference
A. D. Tran, X. Gu, and Y. Hao, “RHIC Electron Beam Cooling Analysis Using Principle Component and Autoencoder Analysis”, in Proc. North American Particle Accelerator Conf. (NAPAC'22), Albuquerque, NM, USA, Aug. 2022, pp. 260-262.
A. D. Tran, Y. Hao, J. L. Martinez Marin, and B. Mustapha, “Relating Initial Distribution to Beam Loss on the Front End of a Heavy-Ion Linac Using Machine Learning”, in Proc. North American Particle Accelerator Conf. (NAPAC'22), Albuquerque, NM, USA, Aug. 2022, pp. 263-266.
A. P. Lee et al., “Emittance and Bunch Length Measurement of the Electron Beams from the NSRRC Photocathode Gun”, in Proc. 5th Int. Particle Accelerator Conf. (IPAC'14), Dresden, Germany, Jun. 2014, pp. 2974-2976.
A. Seryi et al., “The US Electron Ion Collider Accelerator Designs”, in Proc. North American Particle Accelerator Conf. (NAPAC'19), Lansing, MI, USA, Sep. 2019, pp. 1-7.
A. Tran and Y. Hao, “Beam tomography with coupling using maximum entropy technique”, in Proc. 14th Int. Particle Accelerator Conf. (IPAC'23), Venice, Italy, May 2023, paper THOGB2, pp. 3944-3947.
A. Tran, B. Mustapha, and Y. Hao, “Beam tomography using MCMC”, presented at the 15th Int. Particle Accelerator Conf. (IPAC'24), Nashville, TN, USA, May 2024, paper WEPG37, this conference.
B. T. Schwartz et al., “Coherent Electron Cooling: Status of Single-Pass Simulations”, in Proc. 4th Int. Particle Accelerator Conf. (IPAC'13), Shanghai, China, May 2013, paper MOPWO071, pp. 1049-1051.
B. T. Schwartz et al., “Simulations of a Single-Pass Through a Coherent Electron Cooler for 40 Gev/n Au+79”, in Proc. 24th Particle Accelerator Conf. (PAC'11), New York, NY, USA, Mar.-Apr. 2011, paper MOP074, pp. 244-246.
C. Liu et al., “Beam Energy Scan With Asymmetric Collision at RHIC”, in Proc. 8th Int. Particle Accelerator Conf. (IPAC'17), Copenhagen, Denmark, May 2017, pp. 2175-2177.
C. Liu et al., “Study of Orbit Correction for eRHIC FFAG Design”, in Proc. 6th Int. Particle Accelerator Conf. (IPAC'15), Richmond, VA, USA, May 2015, pp. 2366-2368.


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