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Author: S. Chel


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Reference
F. Eoz?®nou, S. Chel, Y. Gasser, J. P. Poupeau, C. Servouin, and Z. Wang, “Vertical Electro-Polishing at CEA Saclay: Commissioning of a New Set-Up and Modeling of the Process Applied to Different Cavities”, in Proc. 15th Int. Conf. RF Superconductivity (SRF'11), Chicago, IL, USA, Jul. 2011, paper TUPO062, pp. 549-554.
G. Bienvenu et al., “Power Coupler Development for SC Cavities”, in Proc. 5th European Particle Accelerator Conf. (EPAC'96), Sitges, Spain, Jun. 1996, paper WEP008L, pp. 2088-2090.
G. Devanz et al., “Cryogenic Tests of a 704 MHZ 1MW Power Coupler”, in Proc. 1st Int. Particle Accelerator Conf. (IPAC'10), Kyoto, Japan, May 2010, paper WEPEC001, pp. 2884-2886.
G. Devanz et al., “Experimental Characterization of a 700 MHz =0.47 5 Cell Superconducting Cavity Prototype for Pulsed Proton Linac”, in Proc. 11th European Particle Accelerator Conf. (EPAC'08), Genoa, Italy, Jun. 2008, paper MOPP126, pp. 853-855.
G. Devanz et al., “IFMIF Resonators Development and Performance”, in Proc. 19th Int. Conf. RF Superconductivity (SRF'19), Dresden, Germany, Jun.-Jul. 2019, pp. 293-296.
G. Devanz et al., “Quarter-wave Cavities for the SPIRAL 2 Project”, in Proc. 11th Workshop RF Superconductivity (SRF'03), Lübeck, Germany, Sep. 2003, paper TUP06, pp. 290-292.
G. Devanz et al., “Tests of 704 MHz 1MW Power Coupler at Saclay”, in Proc. 14th Int. Conf. RF Superconductivity (SRF'09), Berlin, Germany, Sep. 2009, paper THPPO032, pp. 630-633.
H. Dzitko et al., “Design and Manufacturing Status of the IFMIF-LIPAC SRF LINAC”, in Proc. 6th Int. Particle Accelerator Conf. (IPAC'15), Richmond, VA, USA, May 2015, pp. 3686-3688.
H. Dzitko et al., “Technical and Logistical Challenges for IFMIF-LIPAC Cryomodule Construction”, in Proc. 17th Int. Conf. RF Superconductivity (SRF'15), Whistler, Canada, Sep. 2015, paper FRBA01, pp. 1453-1459.
H. Jenhani et al., “Validation of the Series Power Couplers of the LIPAc SRF Linac”, in Proc. 10th Int. Particle Accelerator Conf. (IPAC'19), Melbourne, Australia, May 2019, pp. 2811-2814.


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