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Author: A. Hershcovitch


References



Reference
A. Hershcovitch, M. Blaskiewicz, W. Fischer, and H. J. Poole, “Enhancing RHIC Luminosity Capabilities with In-situ Beam Pipe Coating”, in Proc. 23rd Particle Accelerator Conf. (PAC'09), Vancouver, Canada, May 2009, paper MO6RFP001, pp. 345-347.
A. Hershcovitch, V. Kovarik, and K. Prelec, “Extraction of a Steady State Electron Beam from HCD Plasmas for EBIS Applications”, in Proc. 1st European Particle Accelerator Conf. (EPAC'88), Rome, Italy, Jun. 1988, pp. 585-587.
A. Lajoie, A. Hershcovitch, P. Thieberger, and F. Marti, “Plasma Window as Charge Stripper Complement”, in Proc. 28th Linear Accelerator Conf. (LINAC'16), East Lansing, MI, USA, Sep. 2016, pp. 836-839.
A. Seryi et al., “The US Electron Ion Collider Accelerator Designs”, in Proc. North American Particle Accelerator Conf. (NAPAC'19), Lansing, MI, USA, Sep. 2019, pp. 1-7.
B. M. Johnson, A. Hershcovitch, I. G. Brown, F. Liu, and A. Anders, “Results from ZMEVVA: A New Source for Heavy-Ion Accelerators”, in Proc. 17th Particle Accelerator Conf. (PAC'97), Vancouver, Canada, May 1997, paper 2C007, pp. 2678-2680.
B. M. Johnson, E. Garate, A. Hershcovitch, R. McWilliams, J. P. Sprunck, and A. van Drie, “Further Development of a Low Inductance Metal Vapor Vacuum Arc (LIZ-MeVVA) Ion Source”, in Proc. 10th European Particle Accelerator Conf. (EPAC'06), Edinburgh, UK, Jun. 2006, paper TUPLS103, pp. 1738-1740.
C. Montag et al., “Design Status Update of the Electron-Ion Collider”, in Proc. 12th Int. Particle Accelerator Conf. (IPAC'21), Campinas, Brazil, May 2021, pp. 2585-2588.
C. Montag et al., “eRHIC Design Overview”, in Proc. 10th Int. Particle Accelerator Conf. (IPAC'19), Melbourne, Australia, May 2019, pp. 45-48.
C. Montag et al., “eRHIC Design Update”, in Proc. North American Particle Accelerator Conf. (NAPAC'19), Lansing, MI, USA, Sep. 2019, pp. 18-21.
C. Montag et al., “Overview of the eRHIC Ring-Ring Design”, in Proc. 8th Int. Particle Accelerator Conf. (IPAC'17), Copenhagen, Denmark, May 2017, pp. 3035-3037.


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