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Author: A. T. Wu


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Reference
J. Mammosser et al., “Status of the Production Electropolishing System at JLAB”, in Proc. 20th Particle Accelerator Conf. (PAC'03), Portland, OR, USA, May 2003, paper RPAB062, pp. 2860-2862.
J. Mammosser, T. Rothgeb, T. Wang, and A. T. Wu, “Investigation into the Effectiveness of the JLAB High Pressure Rinsing System”, in Proc. 20th Particle Accelerator Conf. (PAC'03), Portland, OR, USA, May 2003, paper TPAB080, pp. 1386-1388.
A. T. Wu, R. C. Ike, H. L. Phillips, A-M. Valente, H. Wang, and G. Wu, “Surface Study of Nb/Cu Films for Cavity Deposition by ECR Plasma”, in Proc. 21st Particle Accelerator Conf. (PAC'05), Knoxville, TN, USA, May 2005, paper TPPT084, pp. 4153-4155.
H. Wang, H. L. Phillips, R. A. Rimmer, A-M. Valente, A. T. Wu, and G. Wu, “Niobium Thin Film Coating on a 500-MHz Copper Cavity by Plasma Deposition”, in Proc. 21st Particle Accelerator Conf. (PAC'05), Knoxville, TN, USA, May 2005, paper TPPT085, pp. 4167-4169.
J. R. Delayen, J. Mammosser, L. Phillips, and A. T. Wu, “Alternate Electrolyte Composition for Electropolishing of Niobium Surfaces”, in Proc. 10th Workshop RF Superconductivity (SRF'01), Tsukuba, Japan, Sep. 2001, paper PT014, pp. XX-XX.


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