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Author: Y. Tian


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Reference
J. Choi, R. P. Fliller, K. Ha, and Y. Tian, “Database for the Management of NSLS-II Active Interlock System”, in Proc. 9th Int. Particle Accelerator Conf. (IPAC'18), Vancouver, Canada, Apr.-May 2018, pp. 1841-1843.
J. Mead et al., “NSLS-II RF Beam Position Monitor Comissioning Update”, in Proc. 3rd Int. Beam Instrumentation Conf. (IBIC'14), Monterey, CA, USA, Sep. 2014, paper WECYB2, pp. 500-504.
J. Wei et al., “The Compact Pulsed Hadron Source Construction Status”, in Proc. 1st Int. Particle Accelerator Conf. (IPAC'10), Kyoto, Japan, May 2010, paper MOPEC071, pp. 633-635.
K. Ha et al., “NSLS-II Active Interlock System and Post-Mortem Architecture”, in Proc. 7th Int. Particle Accelerator Conf. (IPAC'16), Busan, Korea, May 2016, pp. 4214-4216.
K. Ha et al., “NSLS-II Active Interlock System for Fast Machine Protection”, in Proc. 15th Int. Conf. on Accelerator and Large Experimental Physics Control Systems (ICALEPCS'15), Melbourne, Australia, Oct. 2015, pp. 554-557.
K. Ha, L. R. Dalesio, J. H. De Long, J. Mead, Y. Tian, and K. Vetter, “NSLS-II Beam Position Monitor Embedded Processor and Control System”, in Proc. 13th Int. Conf. on Accelerator and Large Experimental Physics Control Systems (ICALEPCS'11), Grenoble, France, Oct. 2011, paper WEPMN024, pp. 932-934.
K. Vetter et al., “NSLS-II RF Beam Position Monitor Update”, in Proc. 15th Beam Instrumentation Workshop (BIW'12), Newport News, VA, USA, Apr. 2012, paper WECP02, pp. 238-241.
K. Vetter et al., “NSLS-II RF Beam Position Monitor”, in Proc. 14th Beam Instrumentation Workshop (BIW'10), Santa Fe, NM, USA, May 2010, paper TUPSM037, pp. 205-209.
K. Vetter et al., “NSLS-II RF Beam Position Monitor”, in Proc. 24th Particle Accelerator Conf. (PAC'11), New York, NY, USA, Mar.-Apr. 2011, paper MOP211, pp. 495-497.
K. Vetter, W. X. Cheng, J. Mead, B. Podobedov, and Y. Tian, “The BNL EBPM Electronics, High Performance for Next Generation Storage Rings”, in Proc. North American Particle Accelerator Conf. (NAPAC'16), Chicago, IL, USA, Oct. 2016, pp. XX-XX.


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