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Author: J. Sheppard


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Reference
W. Wittmer et al., “SLAC Linac Preparations for FACET”, in Proc. 25th Linear Accelerator Conf. (LINAC'10), Tsukuba, Japan, Sep. 2010, paper MOP007, pp. 61-63.
W. Liu, W. Gai, L. Rinolfi, and J. Sheppard, “An Undulator based Polarized Positron Source for CLIC”, in Proc. 1st Int. Particle Accelerator Conf. (IPAC'10), Kyoto, Japan, May 2010, paper THPEC035, pp. 4131-4133.
W. J. Corbett et al., “Short-Pulse Ti:Sapphire Laser System for Photocathode Research at SLAC”, in Proc. 4th Int. Particle Accelerator Conf. (IPAC'13), Shanghai, China, May 2013, paper WEPME062, pp. 3076-3078.
W. Gai, M. Borland, K.-J. Kim, W. Liu, J. Sheppard, and A. Xiao, “Emittance Evolution of the Drive Electron Beam in a Helical Undulator for ILC Positron Source”, in Proc. 23rd Particle Accelerator Conf. (PAC'09), Vancouver, Canada, May 2009, paper WE6PFP068, pp. 2656-2658.
V. Bharadwaj, R. Pitthan, J. Sheppard, H. Vincke, and J. W. Wang, “Heat Deposition in Positron Sources for ILC”, in Proc. 21st Particle Accelerator Conf. (PAC'05), Knoxville, TN, USA, May 2005, paper RPPP039, pp. 2574-2576.
V. Bharadwaj et al., “Design Issues for the ILC Positron Source”, in Proc. 21st Particle Accelerator Conf. (PAC'05), Knoxville, TN, USA, May 2005, paper TPPE053, pp. 3230-3232.
T. Vecchione et al., “SLAC RF Gun Photocathode Test Facility”, in Proc. 35th Int. Free Electron Laser Conf. (FEL'13), New York, NY, USA, Aug. 2013, paper TUPSO84, pp. 427-430.
T. Raubenheimer et al., “Parameters for the SLAC Next Linear Collider”, in Proc. 16th Particle Accelerator Conf. (PAC'95), Dallas, TX, USA, May 1995, paper RPC01, pp. 698-700.
T. Fieguth et al., “PEP-II Injection Transport Construction Status and Commissioning Plans”, in Proc. 16th Particle Accelerator Conf. (PAC'95), Dallas, TX, USA, May 1995, paper WAQ15, pp. 1876-1878.
R. Jobe, J. Clendenin, H. Schwarz, J. Seeman, J. Sheppard, and R. Stiening, “The RF Phase System of the SLC”, in Proc. 1988 Linear Accelerator Conf. (LINAC'88), Williamsburg, VA, USA, Oct. 1988, paper TH3-26, pp. 592-594.


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