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Author: S. Bai


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Reference
Q. Qin et al., “Overview of the CEPC Accelerator”, in Proc. 55th ICFA Advanced Beam Dynamics Workshop on High Luminosity Circular e+e- Colliders - Higgs Factory (HF'14), Beijing, China, Oct. 2014, paper THP3H2, pp. 16-21.
H. Geng et al., “Status of CEPC Lattice Design”, in Proc. 55th ICFA Advanced Beam Dynamics Workshop on High Luminosity Circular e+e- Colliders - Higgs Factory (HF'14), Beijing, China, Oct. 2014, paper THT4B4, pp. 45-48.
B. Bolzon, S. Bai, P. Bambade, A. Jeremie, and G. R. White, “Linear Collider Test Facility: Twiss Parameter Analysis at the IP/Post-IP location of the ATF2 beam line”, in Proc. 1st Int. Particle Accelerator Conf. (IPAC'10), Kyoto, Japan, May 2010, paper THPD077, pp. 4458-4460.
S. Bai, P. Bambade, B. Bolzon, and J. Gao, “Simulation of Multiknobs Correction at ATF2”, in Proc. 1st Int. Particle Accelerator Conf. (IPAC'10), Kyoto, Japan, May 2010, paper THPD096, pp. 4512-4514.
G. R. White et al., “Operational Experiences Tuning the ATF2 Final Focus Optics Towards Obtaining a 37nm Electron Beam IP Spot Size”, in Proc. 1st Int. Particle Accelerator Conf. (IPAC'10), Kyoto, Japan, May 2010, paper WEOBMH01, pp. 2383-2385.
A. Seryi et al., “ATF2 Commissioning”, in Proc. 23rd Particle Accelerator Conf. (PAC'09), Vancouver, Canada, May 2009, paper FR1RAI03, pp. 4205-4209.
S. Bai et al., “Beam Waist Manipulations at the ATF2 Interaction Point”, in Proc. 23rd Particle Accelerator Conf. (PAC'09), Vancouver, Canada, May 2009, paper TH6PFP024, pp. 3747-3749.
R. Tom?ís et al., “ATF2 Ultra-Low IP Betas Proposal”, in Proc. 23rd Particle Accelerator Conf. (PAC'09), Vancouver, Canada, May 2009, paper WE6PFP024, pp. 2540-2542.
J. Y. Tang et al., “Preliminary Accelerator Design of a Circular Higgs Factory in China”, in Proc. North American Particle Accelerator Conf. (NAPAC'13), Pasadena, CA, USA, Sep.-Oct. 2013, paper TUPBA03, pp. 523-525.
C. H. Yu et al., “The Status of CEPC”, in Proc. 62nd ICFA Advanced Beam Dynamics Workshop on High Luminosity Circular e+e- Colliders (eeFACT'18), Hong Kong, China, Sep. 2018, pp. 30.


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