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Author: S. Arsenyev


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Reference
B. Riemann, S. Khan, S. Arsenyev, and D. Schulte, “Resistive-Wall Impedance of Insertions for FCC-hh”, in Proc. 9th Int. Particle Accelerator Conf. (IPAC'18), Vancouver, Canada, Apr.-May 2018, pp. 378-381.
B. Salvant et al., “Building the Impedance Model of a Real Machine”, in Proc. 10th Int. Particle Accelerator Conf. (IPAC'19), Melbourne, Australia, May 2019, pp. 2249-2254.
C. Tambasco et al., “Landau Damping Studies for the FCC: Octupole Magnets, Electron Lens and Beam-Beam Effects”, in Proc. 9th Int. Particle Accelerator Conf. (IPAC'18), Vancouver, Canada, Apr.-May 2018, pp. 3150-3153.
E. I. Simakov et al., “Experimental Study of Wakefields in an X-band Photonic Band Gap Accelerating Structure”, in Proc. 6th Int. Particle Accelerator Conf. (IPAC'15), Richmond, VA, USA, May 2015, pp. 2689-2691.
E. I. Simakov et al., “Results of the New High Power Tests of Superconducting Photonic Band Gap Structure Cells”, in Proc. North American Particle Accelerator Conf. (NAPAC'13), Pasadena, CA, USA, Sep.-Oct. 2013, paper WEPAC33, pp. 850-852.
E. I. Simakov et al., “Superconducting Photonic Band Gap Structures for High-Current Applications”, in Proc. 16th Int. Conf. RF Superconductivity (SRF'13), Paris, France, Sep. 2013, paper THIOC03, pp. 860-864.
E. I. Simakov et al., “Update on Fabrication and Tuning of the Photonic Band Gap Accelerating Structure for the Wakefield Experiment”, in Proc. North American Particle Accelerator Conf. (NAPAC'13), Pasadena, CA, USA, Sep.-Oct. 2013, paper MOPAC25, pp. 120-122.
F. Zimmermann et al., “High-Energy LHC Design”, in Proc. 9th Int. Particle Accelerator Conf. (IPAC'18), Vancouver, Canada, Apr.-May 2018, pp. 269-272.
F. Zimmermann et al., “Updated High-Energy LHC Design”, in Proc. 10th Int. Particle Accelerator Conf. (IPAC'19), Melbourne, Australia, May 2019, pp. 524-527.
H. Jenhani, S. Arsenyev, S. Kazakov, and N. Solyak, “PIP-II 650 MHz Power Coupler Thermal Studies”, in Proc. 20th International Conference on RF Superconductivity (SRF'21), East Lansing, MI, USA, Jun.-Jul. 2021, pp. 490.


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