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Author: F. M. Esser


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Reference
E. Zaplatin, R. Eichhorn, F. M. Esser, B. Laatsch, and R. Stassen, “COSY SC HWR Investigations”, in Proc. 11th Workshop RF Superconductivity (SRF'03), Lübeck, Germany, Sep. 2003, paper TUP45, pp. 437-441.
F. M. Esser et al., “Development Work for a Short Curved Superconducting Dipole Magnet for the HESR at FAIR”, in Proc. 11th European Particle Accelerator Conf. (EPAC'08), Genoa, Italy, Jun. 2008, paper WEPD011, pp. 2425-2427.
F. M. Esser et al., “Vacuum System of the HESR at FAIR, Status of Tests, Layout and Manufacturing”, in Proc. 9th Int. Particle Accelerator Conf. (IPAC'18), Vancouver, Canada, Apr.-May 2018, pp. 2748-2750.
F. M. Esser, R. Eichhorn, B. Laatsch, H. S. Singer, and R. Stassen, “First Cool Down of the Juelich Accelerator Module Based on Superconducting Half-Wave Resonators”, in Proc. 10th European Particle Accelerator Conf. (EPAC'06), Edinburgh, UK, Jun. 2006, paper MOPCH186, pp. 496-498.
F. Zahariev et al., “Developments for the Injection Kicker Vacuum System of the HESR at FAIR”, in Proc. 8th Int. Particle Accelerator Conf. (IPAC'17), Copenhagen, Denmark, May 2017, pp. 3369-3371.
H. Jagdfeld et al., “Bakeout Concept for the HESR at FAIR”, in Proc. 6th Int. Particle Accelerator Conf. (IPAC'15), Richmond, VA, USA, May 2015, pp. 2832-2834.
H. Jagdfeld et al., “NEG Coated Vacuum Chambers and Bake-Out-Concept for the HESR at FAIR”, in Proc. 9th Int. Particle Accelerator Conf. (IPAC'18), Vancouver, Canada, Apr.-May 2018, pp. 2745-2747.
H. Jagdfeld et al., “Vacuum- and Bake-Out-Testbenches for the HESR at FAIR”, in Proc. 8th Int. Particle Accelerator Conf. (IPAC'17), Copenhagen, Denmark, May 2017, pp. 3366-3368.
R. Eichhorn et al., “Cold Tests of a 160 MHz Half-Wave Resonator”, in Proc. 22nd Linear Accelerator Conf. (LINAC'04), Lübeck, Germany, Aug. 2004, paper THP94, pp. 821-823.
R. Eichhorn et al., “Development of a Pulsed Light Ion Accelerator Module Based on Half-Wave Resonators”, in Proc. 11th Workshop RF Superconductivity (SRF'03), Lübeck, Germany, Sep. 2003, paper THP37, pp. 718-721.


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