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Author: F. M. Esser


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Reference
R. Eichhorn et al., “Development of a Pulsed Light Ion Accelerator Module Based on Half-Wave Resonators”, in Proc. 11th Workshop RF Superconductivity (SRF'03), Lübeck, Germany, Sep. 2003, paper THP37, pp. 718-721.
R. Eichhorn et al., “Cold Tests of a 160 MHz Half-Wave Resonator”, in Proc. 22nd Linear Accelerator Conf. (LINAC'04), Lübeck, Germany, Aug. 2004, paper THP94, pp. 821-823.
H. Jagdfeld et al., “Vacuum- and Bake-Out-Testbenches for the HESR at FAIR”, in Proc. 8th Int. Particle Accelerator Conf. (IPAC'17), Copenhagen, Denmark, May 2017, pp. 3366-3368.
H. Jagdfeld et al., “NEG Coated Vacuum Chambers and Bake-Out-Concept for the HESR at FAIR”, in Proc. 9th Int. Particle Accelerator Conf. (IPAC'18), Vancouver, Canada, Apr.-May 2018, pp. 2745-2747.
H. Jagdfeld et al., “Bakeout Concept for the HESR at FAIR”, in Proc. 6th Int. Particle Accelerator Conf. (IPAC'15), Richmond, VA, USA, May 2015, pp. 2832-2834.
F. Zahariev et al., “Developments for the Injection Kicker Vacuum System of the HESR at FAIR”, in Proc. 8th Int. Particle Accelerator Conf. (IPAC'17), Copenhagen, Denmark, May 2017, pp. 3369-3371.
F. M. Esser, R. Eichhorn, B. Laatsch, H. S. Singer, and R. Stassen, “First Cool Down of the Juelich Accelerator Module Based on Superconducting Half-Wave Resonators”, in Proc. 10th European Particle Accelerator Conf. (EPAC'06), Edinburgh, UK, Jun. 2006, paper MOPCH186, pp. 496-498.
F. M. Esser et al., “Vacuum System of the HESR at FAIR, Status of Tests, Layout and Manufacturing”, in Proc. 9th Int. Particle Accelerator Conf. (IPAC'18), Vancouver, Canada, Apr.-May 2018, pp. 2748-2750.
F. M. Esser et al., “Development Work for a Short Curved Superconducting Dipole Magnet for the HESR at FAIR”, in Proc. 11th European Particle Accelerator Conf. (EPAC'08), Genoa, Italy, Jun. 2008, paper WEPD011, pp. 2425-2427.
E. Zaplatin, R. Eichhorn, F. M. Esser, B. Laatsch, and R. Stassen, “COSY SC HWR Investigations”, in Proc. 11th Workshop RF Superconductivity (SRF'03), Lübeck, Germany, Sep. 2003, paper TUP45, pp. 437-441.


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