|
D. X. Xiao, M. Li, Q. Pan, H. Wang, and X. Yang, “Design of Multi-Alkali Photocathode Preparation System for CTFEL Facility”, in Proc. 9th Int. Particle Accelerator Conf. (IPAC'18), Vancouver, Canada, Apr.-May 2018, pp. 1571-1573. |
|
H. Wang, K. Li, M. Li, D. Wu, D. X. Xiao, and X. Yang, “A GaAs Photoemission DC Gun for CAEP High-average-power THz FEL”, in Proc. 36th Int. Free Electron Laser Conf. (FEL'14), Basel, Switzerland, Aug. 2014, paper TUA03, pp. 318-321. |
|
M. Li et al., “Status of CAEP THz Free Electron Laser Oscillator”, in Proc. 60th ICFA Advanced Beam Dynamics Workshop on Future Light Sources (FLS'18), Shanghai, China, Mar. 2018, pp. 154-156. |
|
D. Wu et al., “Studies on Factors Affecting the Life-Time of High Average Current GaAs Photocathode”, in Proc. 12th Symposium on Accelerator Physics (SAP'14), Lanzhou, China, Aug. 2014, paper WEAMH6, pp. 12-15. |
|
R. J. Yang et al., “Ion Tracking in a High-Voltage DC Photo-Gun”, in Proc. 12th Symposium on Accelerator Physics (SAP'14), Lanzhou, China, Aug. 2014, paper WEPH14, pp. 58-61. |
|
X. Luo et al., “Fabrication, Assembly and Test of the 24-cell Superconducting Linac Module for the CAEP FEL-THz facility”, in Proc. 13th Symposium on Accelerator Physics (SAP'17), Jishou, China, Aug. 2017, pp. 19-21. |
|
K. Zhou et al., “Commissioning of the 2x4-cell Superconducting Accelerator for the CAEP THz-FEL Facility”, in Proc. 13th Symposium on Accelerator Physics (SAP'17), Jishou, China, Aug. 2017, pp. 96-98. |
|
D. Wu et al., “Beam Optimization and Measurment of CAEP FEL-THz Injector”, in Proc. 13th Symposium on Accelerator Physics (SAP'17), Jishou, China, Aug. 2017, pp. 179-182. |
|
J. Wang, P. Li, D. Wu, D. X. Xiao, and L. G. Yan, “Design of an Ultrafast Stripline Kicker for Bunch-by-Bunch Feedback”, in Proc. 7th Int. Beam Instrumentation Conf. (IBIC'18), Shanghai, China, Sep. 2018, pp. 322-324. |
|
D. Wu et al., “Differential Evolution Genetic Algorithm for Beam Bunch Temporal Reconstruction”, in Proc. 7th Int. Beam Instrumentation Conf. (IBIC'18), Shanghai, China, Sep. 2018, pp. 392-395. |
