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Author: S. Dastan


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Reference
N. Khosravi, E. Ahmadi, M. Akhyani, S. Dastan, and A. Khosravi, “WAKEFIELD AND HEAT LOAD STUDY OF THE GATE VALVES AT ILSF STORAGE RING”, in Proc. 12th Int. Particle Accelerator Conf. (IPAC'21), Campinas, Brazil, May 2021, pp. 2018-2021.
S. Di Mitri et al., “Transverse deflecting cavities for short X-ray pulses at Elettra 2.0”, in Proc. 14th Int. Particle Accelerator Conf. (IPAC'23), Venice, Italy, May 2023, paper MOPA163, pp. 437-440.
S. Dastan, K. Manukyan, E. Karantzoulis, and S. Krecic, “Broad band impedance effects on Elettra 2.0”, in Proc. 14th Int. Particle Accelerator Conf. (IPAC'23), Venice, Italy, May 2023, paper MOPM051, pp. 1110-1112.
S. Dastan, E. Karantzoulis, K. Manukyan, R. Nagaoka, and S. Krecic, “Study on transverse multi-bunch instability in Elettra 2.0”, in Proc. 14th Int. Particle Accelerator Conf. (IPAC'23), Venice, Italy, May 2023, paper MOPM050, pp. 1106-1109.
M. Lonza, S. Cleva, S. Dastan, and S. Di Mitri, “Transient beam loading studies in view of the Elettra 2.0 upgrade project”, in Proc. 14th Int. Particle Accelerator Conf. (IPAC'23), Venice, Italy, May 2023, paper WEPA009, pp. 2657-2660.
N. Khosravi, E. Ahmadi, M. Akhyani, and S. Dastan, “The impact of the resistive-wall impedance on the ILSF storage ring”, in Proc. 14th Int. Particle Accelerator Conf. (IPAC'23), Venice, Italy, May 2023, paper WEPL163, pp. 3506-3509.
K. Manukyan, B. Diviacco, E. Karantzoulis, S. Dastan, S. Di Mitri, and S. Krecic, “The effect of insertion devices on beam dynamics for Elettra 2.0”, in Proc. 14th Int. Particle Accelerator Conf. (IPAC'23), Venice, Italy, May 2023, paper WEPL094, pp. 3321-3324.
M. Modica et al., “Superbend magnet for Elettra 2.0”, in Proc. 14th Int. Particle Accelerator Conf. (IPAC'23), Venice, Italy, May 2023, paper WEPM056, pp. 3688-3691.
S. Dastan, E. Karantzoulis, K. Manukyan, S. Di Mitri, and S. Krecic, “Incoherent and coherent tune shifts in Elettra 2.0”, in Proc. 15th Int. Particle Accelerator Conf. (IPAC'24), Nashville, TN, USA, May 2024, paper MOPS34, pp. 790-793.


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