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22nd Particle Accelerator Conf. (PAC'07)

22nd Particle Accelerator Conference
Albuquerque, NM, USA, Jun. 2007

Published Aug 2007


References


Reference
K. Hayashi et al., “Klystron Development by TETD”, in Proc. 22nd Particle Accelerator Conf. (PAC'07), Albuquerque, NM, USA, Jun. 2007, paper THIBKI03, pp. 2688-2690.
H. Mori et al., “Developments of Long-pulse Klystron Modulator for KEK Super-conducting RF Test Facility”, in Proc. 22nd Particle Accelerator Conf. (PAC'07), Albuquerque, NM, USA, Jun. 2007, paper THIBKI04, pp. 2691-2692.
M. Wilcox, “European Industry's Potential Capabilities for High Power RF Systems for the Future IlC”, in Proc. 22nd Particle Accelerator Conf. (PAC'07), Albuquerque, NM, USA, Jun. 2007, paper THIBKI05, pp. 2693-2695.
B. F. Shelton, “ILC Underground Cost Analysis in the US”, in Proc. 22nd Particle Accelerator Conf. (PAC'07), Albuquerque, NM, USA, Jun. 2007, paper THICKI01, pp. 2696-2696.
T. Kato and A. Tamura, “Design of Large-sized Accelerator Tunnel”, in Proc. 22nd Particle Accelerator Conf. (PAC'07), Albuquerque, NM, USA, Jun. 2007, paper THICKI02, pp. 2697-2699.
J. Urbin and R. D. Nolte, “Large Helium Refrigeration Plant Operating Experience”, in Proc. 22nd Particle Accelerator Conf. (PAC'07), Albuquerque, NM, USA, Jun. 2007, paper THICKI03, pp. 2700-2700.
J. Yoshida et al., “Development of STF Cryogenic System in KEK”, in Proc. 22nd Particle Accelerator Conf. (PAC'07), Albuquerque, NM, USA, Jun. 2007, paper THICKI04, pp. 2701-2703.
P. Dauguet, “European Industries Potential Capabilities on Cryogenics for the Future IlC”, in Proc. 22nd Particle Accelerator Conf. (PAC'07), Albuquerque, NM, USA, Jun. 2007, paper THICKI05, pp. 2704-2706.
K. Olsen, “Introduction to the PAC'07 International Industrial Forum for the ILC”, in Proc. 22nd Particle Accelerator Conf. (PAC'07), Albuquerque, NM, USA, Jun. 2007, paper THIIKI01, pp. 2664-2664.
C. S. Mishra, “The Importance of Forums to the ILC”, in Proc. 22nd Particle Accelerator Conf. (PAC'07), Albuquerque, NM, USA, Jun. 2007, paper THIIKI02, pp. 2669-2669.

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