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15th Int. Conf. RF Superconductivity (SRF'11)

Chicago, IL, USA, Jul. 2011


References


Reference
N/A, “N/A”, in Proc. 15th Int. Conf. RF Superconductivity (SRF'11), Chicago, IL, USA, Jul. 2011, paper THIOB07, pp. XX-XX.
N/A, “N/A”, in Proc. 15th Int. Conf. RF Superconductivity (SRF'11), Chicago, IL, USA, Jul. 2011, paper THIOB08, pp. XX-XX.
Y. Xie, M. Liepe, and H. Padamsee, “Quench Simulation Using a Ring-Type Defect Model”, in Proc. 15th Int. Conf. RF Superconductivity (SRF'11), Chicago, IL, USA, Jul. 2011, paper THPO001, pp. 687-690.
D. Kostin, Th. Buettner, W.-D. Moeller, and J. K. Sekutowicz, “Multipacting in HOM Couplers at the 1.3GHz 9-cell TESLA Type SRF Cavity”, in Proc. 15th Int. Conf. RF Superconductivity (SRF'11), Chicago, IL, USA, Jul. 2011, paper THPO003, pp. 691-694.
J. Halbritter, “Electro- or Chemical- Polishing and UHV Baking of Superconducting rf Nb Cavities and Q(H) Dependencies”, in Proc. 15th Int. Conf. RF Superconductivity (SRF'11), Chicago, IL, USA, Jul. 2011, paper THPO004, pp. 695-697.
G. V. Eremeev, “Exploration of Very High Gradient Cavities”, in Proc. 15th Int. Conf. RF Superconductivity (SRF'11), Chicago, IL, USA, Jul. 2011, paper THPO005, pp. 698-701.
S. Aull, J. Knobloch, and O. Kugeler, “Study of Trapped Magnetic Flux in Superconducting Niobium Samples”, in Proc. 15th Int. Conf. RF Superconductivity (SRF'11), Chicago, IL, USA, Jul. 2011, paper THPO006, pp. 702-706.
Q. Wu, S. A. Belomestnykh, and I. Ben-Zvi, “Novel Deflecting Cavity Design for eRHIC”, in Proc. 15th Int. Conf. RF Superconductivity (SRF'11), Chicago, IL, USA, Jul. 2011, paper THPO007, pp. 707-709.
A. Romanenko, L. D. Cooley, G. Wu, and G. Ciovati, “Post-Baking Losses in Niobium Cavities Studied by Dissection”, in Proc. 15th Int. Conf. RF Superconductivity (SRF'11), Chicago, IL, USA, Jul. 2011, paper THPO008, pp. 710-713.
S. Posen, M. Liepe, and N. R. A. Valles, “Quench Studies in Large and Fine Grain Nb Cavities”, in Proc. 15th Int. Conf. RF Superconductivity (SRF'11), Chicago, IL, USA, Jul. 2011, paper THPO009, pp. 714-717.

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