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4th Int. Particle Accelerator Conf. (IPAC'13)

Shanghai, China, May 2013


References


Reference
P. Pierini et al., “XFEL 3.9 GHz Prototype Cavities Tests”, in Proc. 4th Int. Particle Accelerator Conf. (IPAC'13), Shanghai, China, May 2013, paper WEPWO012, pp. 2337-2339.
E. Kako et al., “High Power Tests of Injector Cryomodule for Compact-ERL”, in Proc. 4th Int. Particle Accelerator Conf. (IPAC'13), Shanghai, China, May 2013, paper WEPWO013, pp. 2340-2342.
T. Kubo, T. Saeki, and Y. Iwashita, “Rf Field-Attenuation Formulae for the Multilayer Coating Model”, in Proc. 4th Int. Particle Accelerator Conf. (IPAC'13), Shanghai, China, May 2013, paper WEPWO014, pp. 2343-2345.
T. Kubo et al., “Electron Beam Welding for High Gradient Superconducting Cavity”, in Proc. 4th Int. Particle Accelerator Conf. (IPAC'13), Shanghai, China, May 2013, paper WEPWO015, pp. 2346-2348.
K. Umemori et al., “Construction of Main Linac Cryomodule for Compact ERL Project”, in Proc. 4th Int. Particle Accelerator Conf. (IPAC'13), Shanghai, China, May 2013, paper WEPWO016, pp. 2349-2351.
Y. Iwashita et al., “Efforts on Nondestructive Inspections for SC Cavities”, in Proc. 4th Int. Particle Accelerator Conf. (IPAC'13), Shanghai, China, May 2013, paper WEPWO017, pp. 2352-2354.
J. Gao et al., “Status of the IHEP 1.3 GHz Superconducting RF Program for the ILC”, in Proc. 4th Int. Particle Accelerator Conf. (IPAC'13), Shanghai, China, May 2013, paper WEPWO018, pp. 2355-2357.
S. Jin et al., “Development of Frequency Measurement Setup for ADS 650MHz and 1.3GHz Superconducting RF Cavities at IHEP”, in Proc. 4th Int. Particle Accelerator Conf. (IPAC'13), Shanghai, China, May 2013, paper WEPWO019, pp. 2358-2360.
Z. C. Liu et al., “ADS 650MHz =0.82 Supercongducting Cavity Research Status”, in Proc. 4th Int. Particle Accelerator Conf. (IPAC'13), Shanghai, China, May 2013, paper WEPWO021, pp. 2361-2363.
Z. C. Liu et al., “IHEP03 Fabrication and Testing Status”, in Proc. 4th Int. Particle Accelerator Conf. (IPAC'13), Shanghai, China, May 2013, paper WEPWO022, pp. 2364-2365.

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