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19th Int. Conf. RF Superconductivity (SRF'19)

Dresden, Germany, Jun.-Jul. 2019

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	Reference
	Z. Sun et al., “Electroplating of Sn Film on Nb Substrate for Generating Nb?Sn Thin Films and Post Laser Annealing”, in Proc. 19th Int. Conf. RF Superconductivity (SRF'19), Dresden, Germany, Jun.-Jul. 2019, pp. 51-54.
	Z. Sun et al., “Electroplating of Sn Film on Nb Substrate for Generating Nb?Sn Thin Films and Post Laser Annealing”, in Proc. 19th Int. Conf. RF Superconductivity (SRF'19), Dresden, Germany, Jun.-Jul. 2019, pp. 51-54.
	Z. Q. Yang et al., “Development of Nb?Sn Cavity Coating at IMP”, in Proc. 19th Int. Conf. RF Superconductivity (SRF'19), Dresden, Germany, Jun.-Jul. 2019, pp. 21-24.
	Z. Q. Lin et al., “The Study of High Power Couplers for CIADS”, in Proc. 19th Int. Conf. RF Superconductivity (SRF'19), Dresden, Germany, Jun.-Jul. 2019, pp. 241-244.
	Z. Q. Lin et al., “The Study of High Power Couplers for CIADS”, in Proc. 19th Int. Conf. RF Superconductivity (SRF'19), Dresden, Germany, Jun.-Jul. 2019, pp. 241-244.
	Z. H. Mi et al., “Tuner Design and Test for 166.6 MHz SRF Cavity of HEPS”, in Proc. 19th Int. Conf. RF Superconductivity (SRF'19), Dresden, Germany, Jun.-Jul. 2019, pp. 642-645.
	Y. Yang, X. Y. Lu, W. W. Tan, L. Xiao, D. Xie, and L. Zhu, “Pulse Laser Annealing of Niobium Film on Copper for SRF Cavities”, in Proc. 19th Int. Conf. RF Superconductivity (SRF'19), Dresden, Germany, Jun.-Jul. 2019, pp. 848-851.
	Y. Yamamoto and S. Michizono, “Ceramic Study on RF Windows for Power Coupler, Waveguide, and Klystron in Particle Accelerator”, in Proc. 19th Int. Conf. RF Superconductivity (SRF'19), Dresden, Germany, Jun.-Jul. 2019, pp. 255-259.
	Y. Okii et al., “R&D of Copper Electroplating Process for Power Couplers: Effect of Microstructures on RRR”, in Proc. 19th Int. Conf. RF Superconductivity (SRF'19), Dresden, Germany, Jun.-Jul. 2019, pp. 278-281.
	Y. Ma et al., “Microphonics Suppression Study in ARIEL e-Linac Cryomodules”, in Proc. 19th Int. Conf. RF Superconductivity (SRF'19), Dresden, Germany, Jun.-Jul. 2019, pp. 136-140.

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