[n] F. Motschmann, B. Baudouy, F. Eozénou, T. Proslier, and C. Verdy, “Cold spray additive manufactured copper as substrate for thin film-SRF cavities”, presented at the SRF'25, Tokyo, Japan, Sep. 2025, paper THP25, unpublished.
%\cite{Motschmann:SRF25-THP25} \bibitem{Motschmann:SRF25-THP25} F. Motschmann, B. Baudouy, F. Eozénou, T. Proslier, and C. Verdy, \textquotedblleft{Cold spray additive manufactured copper as substrate for thin film-SRF cavities}\textquotedblright, presented at the SRF’25, Tokyo, Japan, Sep. 2025, paper THP25, unpublished.
@unpublished{motschmann:srf25-thp25, author = {F. Motschmann and B. Baudouy and F. Eozénou and T. Proslier and C. Verdy}, title = {{Cold spray additive manufactured copper as substrate for thin film-SRF cavities}}, pages = {}, paper = {THP25}, venue = {Tokyo, Japan, Sep. 2025}, intype = {presented at the}, series = {Int. Conf. on RF Superconductivity}, number = {22}, publisher = {JACoW Publishing, Geneva, Switzerland}, issn = {2673-5504}, note = {presented at SRF'25, Tokyo, Japan, Sep. 2025, paper THP25, unpublished}, language = {english} }