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[n] T.-C. Yu et al., “Dual Chip in Single Module Solid-State Power Amplifier Design for Compact Transmitter Architecture”, in Proc. IPAC'13, Shanghai, China, May 2013, paper TUODB203, pp. 1158-1160.
[n] B. Podobedov, L. Ecker, D. A. Harder, and G. Rakowsky, “Eddy Current Shielding by Electrically Thick Vacuum Chambers”, in Proc. PAC'09, Vancouver, Canada, May 2009, paper TH5PFP083, pp. 3398-3400.
[n] V. A. Kiselev, V. Smaluk, and V. Zorin, “Transverse Coupling Impedance of the VEPP-4M Collider: Measurements and Simulations”, in Proc. PAC'01, Chicago, IL, USA, Jun. 2001, paper TPPH071, pp. 1826-1828.
[n] V. E. Blinov et al., “RF Orbit Separation for CPT-Test Experiment at VEPP-4M”, in Proc. IPAC'13, Shanghai, China, May 2013, paper TUPME028, pp. 1634-1636.
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References
- T.-C. Yu et al., “Dual Chip in Single Module Solid-State Power Amplifier Design for Compact Transmitter Architecture”, in Proc. 4th Int. Particle Accelerator Conf. (IPAC'13), Shanghai, China, May 2013, paper TUODB203, pp. 1158-1160.
- B. Podobedov, L. Ecker, D. A. Harder, and G. Rakowsky, “Eddy Current Shielding by Electrically Thick Vacuum Chambers”, in Proc. 23rd Particle Accelerator Conf. (PAC'09), Vancouver, Canada, May 2009, paper TH5PFP083, pp. 3398-3400.
- V. A. Kiselev, V. Smaluk, and V. Zorin, “Transverse Coupling Impedance of the VEPP-4M Collider: Measurements and Simulations”, in Proc. 19th Particle Accelerator Conf. (PAC'01), Chicago, IL, USA, Jun. 2001, paper TPPH071, pp. 1826-1828.
- V. E. Blinov et al., “RF Orbit Separation for CPT-Test Experiment at VEPP-4M”, in Proc. 4th Int. Particle Accelerator Conf. (IPAC'13), Shanghai, China, May 2013, paper TUPME028, pp. 1634-1636.
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