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[n]	E. G. Parozzi et al., “The ENUBET Multi Momentum Secondary Beamline Design”, in Proc. IPAC'21, Campinas, Brazil, May 2021, pp. 3053-3056. doi:10.18429/JACoW-IPAC2021-WEPAB187

[n]	R. Veness et al., “Beam Vacuum Interconnects for the LHC Cold Arcs”, in Proc. PAC'99, New York, NY, USA, Mar. 1999, paper TUA114, pp. 1339-1341. 

For LaTeX

%\cite{Parozzi:IPAC21-WEPAB187} \bibitem{Parozzi:IPAC21-WEPAB187} E. G. Parozzi \emph{et al.}, \textquotedblleft{The ENUBET Multi Momentum Secondary Beamline Design}\textquotedblright, in \emph{Proc. IPAC’21}, Campinas, Brazil, May 2021, pp. 3053--3056. \doi{10.18429/JACoW-IPAC2021-WEPAB187} %\cite{Veness:PAC99-TUA114} \bibitem{Veness:PAC99-TUA114} R. Veness \emph{et al.}, \textquotedblleft{Beam Vacuum Interconnects for the LHC Cold Arcs}\textquotedblright, in \emph{Proc. PAC’99}, New York, NY, USA, Mar. 1999, paper TUA114, pp. 1339--1341.

For BibTeX

@inproceedings{parozzi:ipac21-wepab187, author = {E. G. Parozzi and others}, title = {{The ENUBET Multi Momentum Secondary Beamline Design}}, booktitle = {Proc. IPAC'21}, pages = {3053--3056}, paper = {WEPAB187}, venue = {Campinas, Brazil, May 2021}, publisher = {JACoW Publishing, Geneva, Switzerland}, doi = {10.18429/JACoW-IPAC2021-WEPAB187}, url = {https://jacow.org/ipac2021/papers/WEPAB187.pdf}, language = {english} } @inproceedings{veness:pac99-tua114, author = {R. Veness and others}, title = {{Beam Vacuum Interconnects for the LHC Cold Arcs}}, booktitle = {Proc. PAC'99}, pages = {1339--1341}, paper = {TUA114}, venue = {New York, NY, USA, Mar. 1999}, publisher = {JACoW Publishing, Geneva, Switzerland}, url = {https://jacow.org/p99/papers/TUA114.pdf}, language = {english} }

References

• E. G. Parozzi et al., “The ENUBET Multi Momentum Secondary Beamline Design”, in Proc. 12th Int. Particle Accelerator Conf. (IPAC'21), Campinas, Brazil, May 2021, pp. 3053-3056.
• R. Veness et al., “Beam Vacuum Interconnects for the LHC Cold Arcs”, in Proc. 18th Particle Accelerator Conf. (PAC'99), New York, NY, USA, Mar. 1999, paper TUA114, pp. 1339-1341.