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[n]	T. Tanaka, “Simulation of Pulsed Temperature Rise in Cryogenic Copper RF Cavity Achieving a Very High Accelerating Field”, in Proc. IPAC'18, Vancouver, Canada, Apr.-May 2018, pp. 3788-3791. doi:10.18429/JACoW-IPAC2018-THPAL061

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Paper Title: Simulation of Pulsed Temperature Rise in Cryogenic Copper RF Cavity Achieving a Very High Accelerating Field
Paper URL: http://accelconf.web.cern.ch/ipac2018/papers/THPAL061.pdf
Conference: 9th Int. Particle Accelerator Conf. (IPAC'18)
Paper ID: THPAL061
Location in proceedings: 3788-3791
Original Author String: T. Tanaka

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