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Reference

For Word

[n]	T. Y. Chung et al., “Reduction of Dynamic Multipole Content in Insertion Devices Using Flat Wires”, in Proc. IPAC'18, Vancouver, Canada, Apr.-May 2018, pp. 4313-4316. doi:10.18429/JACoW-IPAC2018-THPMK012

For LaTeX

%\cite{Chung:IPAC18-THPMK012} \bibitem{Chung:IPAC18-THPMK012} T. Y. Chung \emph{et al.}, \textquotedblleft{Reduction of Dynamic Multipole Content in Insertion Devices Using Flat Wires}\textquotedblright, in \emph{Proc. IPAC’18}, Vancouver, Canada, Apr.-May 2018, pp. 4313--4316. \url{doi:10.18429/JACoW-IPAC2018-THPMK012}

For BibTeX

@inproceedings{chung:ipac18-thpmk012, author = {T. Y. Chung and others}, title = {{Reduction of Dynamic Multipole Content in Insertion Devices Using Flat Wires}}, booktitle = {Proc. IPAC'18}, pages = {4313--4316}, paper = {THPMK012}, venue = {Vancouver, Canada, Apr.-May 2018}, publisher = {JACoW Publishing, Geneva, Switzerland}, doi = {10.18429/JACoW-IPAC2018-THPMK012}, url = {http://accelconf.web.cern.ch/ipac2018/papers/THPMK012.pdf}, language = {english} }

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Metadata

Paper Title: Reduction of Dynamic Multipole Content in Insertion Devices Using Flat Wires
Paper URL: http://accelconf.web.cern.ch/ipac2018/papers/THPMK012.pdf
Conference: 9th Int. Particle Accelerator Conf. (IPAC'18)
Paper ID: THPMK012
Location in proceedings: 4313-4316
Original Author String: T.Y. Chung, S.D. Chen, M.-S. Chiu, S.J. Huang, C.-S. Hwang, J.C. Jan, C.Y. Kuo, Y.T. Li, C.Y. Wu [NSRRC, Hsinchu, Taiwan] C.-S. Hwang [NCTU, Hsinchu, Taiwan]

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