[n] A. Miura, Y. Kawane, K. Moriya, S. Fukuoka, K. Futatsukawa, and T. Miyao, “Tensile Fracture Test of Metallic Wire of Beam Profile Monitors”, in Proc. IPAC'18, Vancouver, Canada, Apr.-May 2018, pp. 2183-2186. doi:10.18429/JACoW-IPAC2018-WEPAL016
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Paper Title: Tensile Fracture Test of Metallic Wire of Beam Profile Monitors
Paper URL: http://accelconf.web.cern.ch/ipac2018/papers/WEPAL016.pdf
Conference: 9th Int. Particle Accelerator Conf. (IPAC'18)
Paper ID: WEPAL016
Location in proceedings: 2183-2186
Original Author String: A. Miura, Y. Kawane, K. Moriya [JAEA/J-PARC, Tokai-mura, Japan] S. Fukuoka [Nihon Koshuha Co. Ltd, Yokohama, Japan] K. Futatsukawa, T. Miyao [KEK, Ibaraki, Japan]