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[n]	V. Danielyan et al., “Copper Accelerating Structure Fabrication With Controled Cu-Ag Joining Conditions”, in Proc. IPAC'17, Copenhagen, Denmark, May 2017, pp. 4104-4107. doi:10.18429/JACoW-IPAC2017-THPIK001

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Paper Title: Copper Accelerating Structure Fabrication With Controled Cu-Ag Joining Conditions
Paper URL: https://jacow.org/ipac2017/papers/THPIK001.pdf
Conference: 8th Int. Particle Accelerator Conf. (IPAC'17)
Paper ID: THPIK001
Location in proceedings: 4104-4107
Original Author String: V. Danielyan, V.S. Avagyan, S.G. Dekhtiarov, T.H. Mkrtchyan, S. Naghdalyan, A.S. Simonyan, V. V. Vardanyan [CANDLE SRI, Yerevan, Armenia] A.V. Tsakanian [HZB, Berlin, Germany]

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