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[n]	A. Liu, J. P. Biswas, J. R. Callahan, M. Gaowei, and S. Poddar, “Encapsulation of Photocathodes Using High Power Pulsed RF Sputtering of hBN”, in Proc. NAPAC'22, Albuquerque, NM, USA, Aug. 2022, pp. 760-763. doi:10.18429/JACoW-NAPAC2022-WEPA56

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Paper Title: Encapsulation of Photocathodes Using High Power Pulsed RF Sputtering of hBN
Paper URL: https://jacow.org/napac2022/papers/WEPA56.pdf
Conference: North American Particle Accelerator Conf. (NAPAC'22)
Paper ID: WEPA56
Location in proceedings: 760-763
Original Author String: A. Liu,J. P. Biswas,J. R. Callahan,M. Gaowei,S. Poddar

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