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[n]	S. B. Leith et al., “The Development of HiPIMS Multilayer SIS Film Coatings on Copper for SRF Applications”, in Proc. SRF'21, East Lansing, MI, USA, Jun.-Jul. 2021, pp. 86. doi:10.18429/JACoW-SRF2021-SUPFDV012

For LaTeX

%\cite{Leith:SRF21-SUPFDV012} \bibitem{Leith:SRF21-SUPFDV012} S. B. Leith \emph{et al.}, \textquotedblleft{The Development of HiPIMS Multilayer SIS Film Coatings on Copper for SRF Applications}\textquotedblright, in \emph{Proc. SRF’21}, East Lansing, MI, USA, Jun.-Jul. 2021, pp. 86. \url{doi:10.18429/JACoW-SRF2021-SUPFDV012}

For BibTeX

@inproceedings{leith:srf21-supfdv012, author = {S. B. Leith and others}, title = {{The Development of HiPIMS Multilayer SIS Film Coatings on Copper for SRF Applications}}, booktitle = {Proc. SRF'21}, pages = {86}, paper = {SUPFDV012}, venue = {East Lansing, MI, USA}, series = {International Conference on RF Superconductivity}, number = {20}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {10}, year = {2022}, issn = {2673-5504}, isbn = {978-3-95-450233-2}, doi = {10.18429/JACoW-SRF2021-SUPFDV012}, url = {https://jacow.org/srf2021/papers/SUPFDV012.pdf}, language = {english} }

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Metadata

Paper Title: The Development of HiPIMS Multilayer SIS Film Coatings on Copper for SRF Applications
Paper URL: https://jacow.org/srf2021/papers/SUPFDV012.pdf
Conference: 20th Int. Conf. RF Superconductivity (SRF'21)
Paper ID: SUPFDV012
Location in proceedings: 86
Original Author String: S.B. Leith, X. Jiang, A.O. Sezgin, M. Vogel, S. Keckert, O. Kugeler, D.B. Tikhonov, J. Knobloch, B. Butz, Y. Li, J. M??ller, R. Ries, E. Seiler

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