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[n]	C. Pira et al., “Plasma Electrolytic Polishing as a Promising Treatment Replacement of Electropolishing in the Copper and Niobium Substrate Preparation for SRF”, in Proc. SRF'21, East Lansing, MI, USA, Jun.-Jul. 2021, pp. 718. doi:10.18429/JACoW-SRF2021-THOTEV06

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Paper Title: Plasma Electrolytic Polishing as a Promising Treatment Replacement of Electropolishing in the Copper and Niobium Substrate Preparation for SRF
Paper URL: https://jacow.org/srf2021/papers/THOTEV06.pdf
Conference: 20th Int. Conf. RF Superconductivity (SRF'21)
Paper ID: THOTEV06
Location in proceedings: 718
Original Author String: C. Pira, O. Azzolini, R. Caforio, E. Chyhyrynets, V. A. Garcia, G. Keppel, F. Stivanello

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