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For Word

[n]	K. Nii et al., “Impact of Vertical Electropolishing with Flipping System on Removal Uniformity and Surface State: Study with 9-Cell Niobium Coupon Cavity”, in Proc. SRF'21, East Lansing, MI, USA, Jun.-Jul. 2021, pp. 783. doi:10.18429/JACoW-SRF2021-THPCAV003

For LaTeX

%\cite{Nii:SRF21-THPCAV003} \bibitem{Nii:SRF21-THPCAV003} K. Nii \emph{et al.}, \textquotedblleft{Impact of Vertical Electropolishing with Flipping System on Removal Uniformity and Surface State: Study with 9-Cell Niobium Coupon Cavity}\textquotedblright, in \emph{Proc. SRF’21}, East Lansing, MI, USA, Jun.-Jul. 2021, pp. 783. \url{doi:10.18429/JACoW-SRF2021-THPCAV003}

For BibTeX

@inproceedings{nii:srf21-thpcav003, author = {K. Nii and others}, title = {{Impact of Vertical Electropolishing with Flipping System on Removal Uniformity and Surface State: Study with 9-Cell Niobium Coupon Cavity}}, booktitle = {Proc. SRF'21}, pages = {783}, paper = {THPCAV003}, venue = {East Lansing, MI, USA}, series = {International Conference on RF Superconductivity}, number = {20}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {10}, year = {2022}, issn = {2673-5504}, isbn = {978-3-95-450233-2}, doi = {10.18429/JACoW-SRF2021-THPCAV003}, url = {https://jacow.org/srf2021/papers/THPCAV003.pdf}, language = {english} }

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Metadata

Paper Title: Impact of Vertical Electropolishing with Flipping System on Removal Uniformity and Surface State: Study with 9-Cell Niobium Coupon Cavity
Paper URL: https://jacow.org/srf2021/papers/THPCAV003.pdf
Conference: 20th Int. Conf. RF Superconductivity (SRF'21)
Paper ID: THPCAV003
Location in proceedings: 783
Original Author String: K. Nii, V. Chouhan, Y.I. Ida, T.Y. Yamaguchi, H. Hayano, S. Kato, H. Monjushiro, T. Saeki

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