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For Word

[n]	C.-S. Huang, B.-Y. Chen, C.-K. Kuan, W.-Y. Lai, T.-C. Tseng, and H.-S. Wang, “Anodic bonding of silicon and glass for bent monochromator”, in Proc. IPAC'23, Venice, Italy, May 2023, pp. 4953-4956. doi:10.18429/JACoW-IPAC2023-THPM028

For LaTeX

%\cite{C.-S:IPAC23-THPM028} \bibitem{C.-S:IPAC23-THPM028} C.-S. Huang, B.-Y. Chen, C.-K. Kuan, W.-Y. Lai, T.-C. Tseng, and H.-S. Wang, \textquotedblleft{Anodic bonding of silicon and glass for bent monochromator}\textquotedblright, in \emph{Proc. IPAC’23}, Venice, Italy, May 2023, pp. 4953--4956. \url{doi:10.18429/JACoW-IPAC2023-THPM028}

For BibTeX

@inproceedings{c.-s:ipac23-thpm028, author = {C.-S. Huang and B.-Y. Chen and C.-K. Kuan and W.-Y. Lai and T.-C. Tseng and H.-S. Wang}, title = {{Anodic bonding of silicon and glass for bent monochromator}}, booktitle = {Proc. IPAC'23}, pages = {4953--4956}, paper = {THPM028}, venue = {Venice, Italy}, series = {International Particle Accelerator Conference}, number = {14}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {9}, year = {2023}, issn = {2673-5490}, isbn = {978-3-95-450231-8}, doi = {10.18429/JACoW-IPAC2023-THPM028}, language = {english} }

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