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Reference

For Word

[n]	C. Pira et al., “Progress of application and surface enhancement by Plasma Electrolytic Polishing as a new treatment for SRF substrates and accelerator components preparation”, presented at the IPAC'23, Venice, Italy, May 2023, paper THPM036, unpublished.

For LaTeX

%\cite{Pira:IPAC23-THPM036} \bibitem{Pira:IPAC23-THPM036} C. Pira \emph{et al.}, \textquotedblleft{Progress of application and surface enhancement by Plasma Electrolytic Polishing as a new treatment for SRF substrates and accelerator components preparation}\textquotedblright, presented at the IPAC’23, Venice, Italy, May 2023, paper THPM036, unpublished.

For BibTeX

@unpublished{pira:ipac23-thpm036, author = {C. Pira and others}, title = {{Progress of application and surface enhancement by Plasma Electrolytic Polishing as a new treatment for SRF substrates and accelerator components preparation}}, booktitle = {Proc. IPAC'23}, pages = {}, paper = {THPM036}, venue = {Venice, Italy}, intype = {presented at the}, series = {International Particle Accelerator Conference}, number = {14}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {9}, year = {2023}, issn = {2673-5490}, isbn = {978-3-95-450231-8}, note = {presented at IPAC'23, Venice, Italy, May 2023, paper THPM036, unpublished}, language = {english} }

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Metadata

Paper Title: Progress of application and surface enhancement by Plasma Electrolytic Polishing as a new treatment for SRF substrates and accelerator components preparation
Conference: 14th Int. Particle Accelerator Conf. (IPAC'23)
Paper ID: THPM036
Original Author String: C. Pira, E. Chyhyrynets, A. Salmaso, D. Ford, D. Fonnesu, D. Fonnesu, F. Stivanello, G. Keppel, G. Marconato, O. Azzolini, R. Caforio

Associated Authors

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