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Reference

For Word

[n]	V. Candela et al., “Additive Manufacturing of 6 GHz seamless SRF copper cavities: printing, surface treatments and performance investigations”, in Proc. 14th Int. Particle Accelerator Conf. (IPAC'23), Venice, Italy, May 2023, pp. 4943-4946. doi:10.18429/JACoW-IPAC2023-THPM023

For LaTeX

%\cite{VC:IPAC23-THPM023} \bibitem{VC:IPAC23-THPM023} V. Candela \emph{et al.}, \textquotedblleft{Additive Manufacturing of 6 GHz seamless SRF copper cavities: printing, surface treatments and performance investigations}\textquotedblright, in \emph{Proc. 14th Int. Particle Accelerator Conf. (IPAC’23)}, Venice, Italy, May 2023, pp. 4943--4946. \url{doi:10.18429/JACoW-IPAC2023-THPM023}

For BibTeX

@inproceedings{vc:ipac23-thpm023, author = {V. Candela and others}, title = {{Additive Manufacturing of 6 GHz seamless SRF copper cavities: printing, surface treatments and performance investigations}}, booktitle = {Proc. IPAC'23}, pages = {4943--4946}, paper = {THPM023}, venue = {Venice, Italy}, series = {International Particle Accelerator Conference}, number = {14}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {9}, year = {2023}, issn = {2673-5490}, isbn = {978-3-95-450231-8}, doi = {10.18429/JACoW-IPAC2023-THPM023}, language = {english} }

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Metadata

Paper Title: Additive Manufacturing of 6 GHz seamless SRF copper cavities: printing, surface treatments and performance investigations
Conference: 14th Int. Particle Accelerator Conf. (IPAC'23)
Paper ID: THPM023
Location in proceedings: 4943-4946
Original Author String: V. Candela, M. Bonesso, S. Candela, E. Chyhyrynets, R. Dima, G. Favero, D. Ford, C. Pira, M. Pozzi, P. Rebesan, A. Pepato

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