[n] L. Zhao, G. Cheng, G. Ciovati, and K. M. Wilson, “Copper Plating Qualification Process for the Fundamental Power Coupler Waveguides for CEBAF Cryomodules”, in Proc. SRF'23, Grand Rapids, MI, USA, Jun. 2023, pp. 790-793. doi:10.18429/JACoW-SRF2023-WEPWB087
Use Complete Form
Paper Title: Copper Plating Qualification Process for the Fundamental Power Coupler Waveguides for CEBAF Cryomodules
Conference: 21th Int. Conf. RF Superconductivity (SRF'23)
Paper ID: WEPWB087
Location in proceedings: 790-793
Original Author String: L. Zhao,G. Cheng,G. Ciovati,K. M. Wilson