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[n]	H. Tomizawa, H. Dewa, H. Hanaki, A. Mizuno, and T. Taniuchi, “Development of a High-Pressure Chemical Etching Method as a Surface Treatment for High-Field Accelerating Structures Made of Copper”, in Proc. LINAC'08, Victoria, Canada, Sep.-Oct. 2008, paper THP052, pp. 903-905.

For LaTeX

%\cite{Tomizawa:LINAC08-THP052} \bibitem{Tomizawa:LINAC08-THP052} H. Tomizawa, H. Dewa, H. Hanaki, A. Mizuno, and T. Taniuchi, \textquotedblleft{Development of a High-Pressure Chemical Etching Method as a Surface Treatment for High-Field Accelerating Structures Made of Copper}\textquotedblright, in \emph{Proc. LINAC’08}, Victoria, Canada, Sep.-Oct. 2008, paper THP052, pp. 903--905.

For BibTeX

@inproceedings{tomizawa:linac08-thp052, author = {H. Tomizawa and H. Dewa and H. Hanaki and A. Mizuno and T. Taniuchi}, title = {{Development of a High-Pressure Chemical Etching Method as a Surface Treatment for High-Field Accelerating Structures Made of Copper}}, booktitle = {Proc. LINAC'08}, pages = {903--905}, paper = {THP052}, venue = {Victoria, Canada, Sep.-Oct. 2008}, series = {Linear Accelerator Conference}, number = {24}, publisher = {JACoW Publishing, Geneva, Switzerland}, url = {https://jacow.org/LINAC08/papers/THP052.pdf}, language = {english} }

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Metadata

Paper Title: Development of a High-Pressure Chemical Etching Method as a Surface Treatment for High-Field Accelerating Structures Made of Copper
Paper URL: https://jacow.org/LINAC08/papers/THP052.pdf
Conference: 24th Linear Accelerator Conf. (LINAC'08)
Paper ID: THP052
Location in proceedings: 903-905
Original Author String: H. Tomizawa, H. Dewa, H. Hanaki, A. Mizuno, T. Taniuchi

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