[n] T. Kii, “A Bulk Superconductor and its Application to Insertion Devices”, in Proc. FLS'23, Luzern, Switzerland, Aug.-Sep. 2023, pp. 224-227. doi:10.18429/JACoW-FLS2023-TH1D2
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Paper Title: A Bulk Superconductor and its Application to Insertion Devices
Conference: 67th ICFA Advanced Beam Dynamics Workshop on Future Light Sources (FLS'23)
Paper ID: TH1D2
Location in proceedings: 224-227
Original Author String: T. Kii