[n] F. Micolon et al., “Solder joint cryogenic fatigue of the RHIC 12x150A current leads and mitigation for future operation”, in Proc. IPAC'24, Nashville, TN, USA, May 2024, paper TUPR56, pp. 1556-1559.
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Paper Title: Solder joint cryogenic fatigue of the RHIC 12x150A current leads and mitigation for future operation
Conference: 15th Int. Particle Accelerator Conf. (IPAC'24)
Paper ID: TUPR56
Location in proceedings: 1556-1559
Original Author String: F. Micolon, A. Marusic, C. Mi, D. Bruno, E. Becker, J. Escallier, J. Sandberg, J. Tuozzolo, K. Drees, M. Minty, P. Talty, R. Lambiase, R. Michnoff, R. Than, R. Feder, W. Fischer
