[n] Y. J. Lee, J. Montross, J. Mach, and T. Muth, “Diffusion bonding of tungsten-vanadium-zirconium using vacuum hot pressing for the development of a low decay heat cladding solution for tungsten spallation targets”, in Proc. IPAC'24, Nashville, TN, USA, May 2024, pp. 3837-3840. doi:10.18429/JACoW-IPAC2024-THPS44
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Paper Title: Diffusion bonding of tungsten-vanadium-zirconium using vacuum hot pressing for the development of a low decay heat cladding solution for tungsten spallation targets
Conference: 15th Int. Particle Accelerator Conf. (IPAC'24)
Paper ID: THPS44
Location in proceedings: 3837-3840
Original Author String: Y.J. Lee, J. Montross, J. Mach, T. Muth