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[n]	R. Valizadeh et al., “Optimization of deposition parameters of Nb3Sn thin film on copper with and without buffer layer”, in Proc. IPAC'25, Taipei, Taiwan, Jun. 2025, paper WEPB069, pp.. 

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Paper Title: Optimization of deposition parameters of Nb3Sn thin film on copper with and without buffer layer
Conference: 16th Int. Particle Accelerator Conf. (IPAC'25)
Paper ID: WEPB069
Location in proceedings:
Original Author String: R. Valizadeh, C. Benjamin, G. Burt, J. Conlon, O. Malyshev, D. Seal, S. Simon, L. Smith, G. Stenning

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