[n] R. Valizadeh et al., “Optimization of deposition parameters of Nb3Sn thin film on copper with and without buffer layer”, presented at the IPAC'25, Taipei, Taiwan, Jun. 2025, paper WEPB069, this conference.
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Paper Title: Optimization of deposition parameters of Nb3Sn thin film on copper with and without buffer layer
Conference: 16th Int. Particle Accelerator Conf. (IPAC'25)
Paper ID: WEPB069
Original Author String: R. Valizadeh, C. Benjamin, D. Seal, G. Stenning, G. Burt, J. Conlon, L. Smith, O. Malyshev, S. Simon