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[n]	E. Boos, J. Storch, H. Podlech, and K. Kümpel, “Material properies of 3D-printed copper for rf-cavities”, presented at the IPAC'25, Taipei, Taiwan, Jun. 2025, paper THPB097, this conference. 

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Paper Title: Material properies of 3D-printed copper for rf-cavities
Conference: 16th Int. Particle Accelerator Conf. (IPAC'25)
Paper ID: THPB097
Original Author String: E. Boos, J. Storch, H. Podlech, K. Kümpel

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