[n] J. Storch, E. Boos, K. Kümpel, and H. Podlech, “Material properies of 3D-printed copper for rf-cavities”, in Proc. IPAC'25, Taipei, Taiwan, Jun. 2025, pp. 2673-2676. doi:10.18429/JACoW-IPAC2025-THPB097
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Paper Title: Material properies of 3D-printed copper for rf-cavities
Conference: 16th Int. Particle Accelerator Conf. (IPAC'25)
Paper ID: THPB097
Location in proceedings: 2673-2676
Original Author String: J. Storch, E. Boos, K. Kümpel, H. Podlech