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Reference

For Word

[n]	D. Ford et al., “Additive manufacturing for seamless 6 GHz Nb/Cu cavities”, in Proc. SRF'25, Tokyo, Japan, Sep. 2025, pp. 667-671. doi:10.18429/JACoW-SRF2025-THP31

For LaTeX

%\cite{Ford:SRF25-THP31} \bibitem{Ford:SRF25-THP31} D. Ford \emph{et al.}, \textquotedblleft{Additive manufacturing for seamless 6 GHz Nb/Cu cavities}\textquotedblright, in \emph{Proc. SRF’25}, Tokyo, Japan, Sep. 2025, pp. 667--671. \doi{10.18429/JACoW-SRF2025-THP31}

For BibTeX

@inproceedings{ford:srf25-thp31, author = {D. Ford and others}, title = {{Additive manufacturing for seamless 6 GHz Nb/Cu cavities}}, booktitle = {Proc. SRF'25}, pages = {667--671}, paper = {THP31}, venue = {Tokyo, Japan}, series = {Int. Conf. on RF Superconductivity}, number = {22}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {11}, year = {2026}, issn = {2673-5504}, isbn = {978-3-95-450256-1}, doi = {10.18429/JACoW-SRF2025-THP31}, language = {english} }

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Metadata

Paper Title: Additive manufacturing for seamless 6 GHz Nb/Cu cavities
Conference: 22st International Conference on RF Superconductivity (SRF'25)
Paper ID: THP31
Location in proceedings: 667-671
Original Author String: D. Ford, E. Chyhyrynets, D. Fonnesu, G. Keppel, C. Pira, F. Stivanello, V. Candela, S. Candela, A. Pepato, P. Rebesan

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