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[n]	B. Cheymol, “Effects of Energy Deposition Models and Conductive Cooling on Wire Scanner Thermal Load, Analytical and Finite Element Analysis Approach”, in Proc. HB'16, Malmö, Sweden, Jul. 2016, pp. 221-225. doi:10.18429/JACoW-HB2016-MOPL016

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Paper Title: Effects of Energy Deposition Models and Conductive Cooling on Wire Scanner Thermal Load, Analytical and Finite Element Analysis Approach
Paper URL: https://jacow.org/hb2016/papers/MOPL016.pdf
Conference: 57th ICFA Advanced Beam Dynamics Workshop on High-Intensity and High-Brightness Hadron Beams (HB'16)
Paper ID: MOPL016
Location in proceedings: 221-225
Original Author String: B. Cheymol [ESS, Lund, Sweden]

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